Leuven, Belgium – October 13, 2008 – IMEC, Europe’s leading independent nanoelectronics research institute today announced that it has made significant progress with its 3D-SIC (3D stacked IC) ...

Monolithic 3D integrated circuits represent a transformative approach to semiconductor design, where successive layers of devices are fabricated directly on top of one another using low-temperature ...

You’re probably familiar with the little black boxes nestled neatly inside your favorite devices. With their diminutive size and unassuming characteristics, it can be hard to believe these vessels are ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

On February 6, 1959, Jack Kilby from Texas Instruments filed a patent for the first ever integrated circuit, an invention ...

Scientists are working on a prototype system composed of integrated circuit #d technology that they say will help create human tissues for people with congenital defects or serious internal organ ...

A new technical paper titled “Design-for-Test Solutions for 3D Integrated Circuits” was published by researchers at Duke University, Arizona State University, and NVIDIA. “As Moore’s Law approaches ...

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

Osaka, Japan – Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, ...

Researchers reported a deposition process for nanosheet oxide semiconductor. The atomic layer deposition technique was demonstrated for producing field effect transistors for 3D integrated circuits at ...

The miniaturization of electronic systems and the diffusion of components that generate a lot of heat make the role of thermal analysis more and more important as a tool to guarantee the good ...

With high density power management becoming more critical, there's a greater need to improve power conversion efficiency and control losses. Controlling DC inductor resistance is critical to meeting ...