To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap TM Gen4 is the first to adopt embedded substrate packaging and is currently in the ...
Vietnam Investment Review on MSN
AP Memory expands tech for AI HPC demands
To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap TM Gen4 is the first to adopt embedded substrate packaging and is currently in the ...
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