TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

[Willem Melching] owns a 2010 Volkswagen Golf – a very common vehicle in Europe – and noticed that whilst the electronic steering rack supports the usual Lane Keep Assist (LKAS) system, and would be ...

Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...

Nvidia is scrambling to meet strong demand for its H200 artificial intelligence chips from Chinese technology companies and ...

The WiMAX9xxx IEEE 802.16e-2005 chip scale module reportedly allows handheld manufacturers to quickly design and add WiMax functionality to devices such as handsets, mobile computers, media players, ...

Joule is the latest product in Intel’s family of all-in-one chip modules for the Internet of Things. Intel CEO Brian Krzanich showed off the new Joule module during a keynote speech at the Intel ...

Developers and engineers looking for a one chip hardware security module may be interested in the new Kryptor FPGA created by Skudo OÜ and now available to purchase from the Crowd Supply website. The ...