Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

SEOUL, South Korea, Feb. 2, 2023 /PRNewswire/ -- LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter referred ...

LG Innotek's supply of mobile semiconductor substrates is reportedly expanding. As rival corporations focus on producing high-value flip-chip (FC) ball grid array (BGA) substrates, where demand is ...

Samsung Electro-Mechanics is reportedly pouring over 1 trillion won ($662.3 million) into capital expenditure for a second consecutive year, concentrating its investment on FC-BGA substrates, a ...

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,... Saturday 11 ...

Toppan has addressed a challenge for heterogeneous integration of semiconductors by developing a high-reliability coreless organic interposer1 for next-generation semiconductors with a new product.

Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...