EDN

Fujitsu To Boost Capacity For Flip-Chip BGAs

Fujitsu Ltd. today said it plans to expand its capacity for wafer bumping and Flip-chip-BGA products to meet the demand in the ASIC, DSP, PLD, microprocessor and fast SRAM markets. Fujitsu, along with ...
EDN

4-Mbit FRAM as Substitute for SRAM

The new MB85R4M2T retains data without the need for a battery, enabling systems that require less space, less power, and less cost. The mounting area for memory and related components on PCB boards ...
Electronic Design

Development And Manufacturing Deal Yields Multiple FPGA Families

In a combination technology development and manufacturing deal, Fujitsu Ltd. will provide manufacturing capacity on its 130- and 90-nm process lines for Lattice ...
TechSpot

CPU and GPU SRAM caches are not shrinking, which could increase chip cost or reduce performance

Why it matters: An interesting article posted at WikiChip discusses the severity of SRAM shrinkage problems in the semiconductor industry. Manufacturer TSMC is reporting that its SRAM transistor ...