The two funds target startups in areas such AI and renewable energy across Asia, the U.S. and the EMEA. Kyocera, one of the world’s largest chip component makers, has unveiled two funds totalling $100 ...

BAYAN LEPAS, Malaysia--(BUSINESS WIRE)-- ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan ...

As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its ...

MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging and testing in Malta, the company announced on Friday. The facility will be called the New York Advanced Packaging ...

Project is being supported by $75 million federal grant and $20 million from New York state; GF will also spend $186 million on research GlobalFoundries' Fab 8 campus is seen in February 2024 in Malta ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...