The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Power innovations aren't limited to the silicon, GaN, and SiC transistors that tend to get all of the attention. Humble diodes, inductors, and relays are also enjoying significant advances in ...
Members can download this article in PDF format. Engineers have many options when designing power stages, from low-dropout (LDO) regulators to switching power supplies. The former provide low noise ...
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