Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...
The EP30AN is a two-component, low viscosity epoxy featuring high thermal conductivity and excellent electrical insulation for potting, sealing, coating, and bonding applications. The compound is ...
Master Bond EP3RRLV is a one component, lower viscosity epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 250°F. This unique ...
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