A patent-pending indentation method gathers data on a range of materials for which it was previously unobtainable Using Nanovea’s Mechanical Tester in indentation mode, with a cylindrical flat tip, it ...

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test ...

Balancing yield and test is essential to semiconductor manufacturing, but it’s becoming harder to determine how much weight to give one versus the other as chips become more specialized for different ...