SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
Learn how Elementum 3D improves aluminum 2024 and 6061 using innovative ceramic reinforcements in reactive additive ...
NEO Battery Materials Ltd. ("NEO" or the "Company") , a low-cost, silicon-enhanced battery developer that enables longer-running, rapid-charging batteries for drones, robotics, and electronics, is ...
Fabless French FPGA company, NanoXplore has announced that its NG-Ultra FPGA, which is based on STMicroelectronics’ 28nm ...
Heat is the primary enemy of electronics reliability. In industries like automotive, aerospace, and heavy industrial, the engineering reality is harsh: for ever ...
BANGKOK, Jan 19 (Reuters) - Thailand's investment board said on Monday it had approved an investment worth 65 billion baht ($2.08 billion) by a joint venture led by Taiwan's Zhen Ding Technology, the ...
Intel Corp. today showcased a new class of Intel Core Ultra X9 and X7 processors, the first new chips built on its most advanced 18A manufacturing process. Announced at the CES electronics trade show ...
Microwave cold sintering process (MW-CSP) was used to densify NaCl, KDP, MgMoO₄, Li₂MoO₄, and TiO₂ ceramics. Under the fundamental densification mechanisms dominated by the coupling of the transient ...
After four years of construction, Intel said on Thursday that its Fab 52 semiconductor plant in Chandler, Arizona, is now turning out its first chips. The company also shared more details about the ...
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