DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。

DISCO’s current main customers are semiconductor and electrical components manufacturers, who manufacture products at their own factories using DISCO equipment and processing tools …

Your Nearest DISCO Office DISCO HI-TEC AMERICA, INC. USA Head Office Sales & Service Office

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer. In …

The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI …

The development of Personal Will improves job satisfaction and performance, accelerates the speed of decision making, and eventually leads to increased productivity. DISCO will continue enhancing …

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as materials to …

DISCO cautions you that a number of important factors could cause actual results to differ materially from those discussed in the forward-looking statements, and you should not make decision on your …